Rezultati pretrage - "Microelectronic packaging."

  1. 1
    Slika omota

    Problems encountered with anistatic packaging / B.J. Kinzig and H. Ravner.

    Izdano 1978
    Knjiga

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  2. 2
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    Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package / by Chetan S. Paydenkar.

    Izdano 2001
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  3. 3
    Slika omota

    Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand.

    Izdano 2005
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  4. 4
    Slika omota

    Fundamentals of device and systems packaging : technologies and applications / Rao Tummala.

    Izdano 2019
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  5. 5
    Slika omota

    Advanced electronic packaging.

    Izdano 2006
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  6. 6
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    Modeling and simulation of embedded passives using rational functions in multi-layered substrates / by Kwang Lim Choi.

    Izdano 1999
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  7. 7
    Slika omota

    MEMS packaging / edited by Tai-Ran Hsu.

    Izdano ©2004
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  8. 8
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    Presidential Young Investigator awards / S.A. Bidstrup.

    Izdano 19911997
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  9. 9
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    NASA new Millennium project / D.E. Schimmel.

    Izdano 1996
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  10. 10
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    Reliability of electronic packages and semiconductor devices / Giulio di Giacomo.

    Izdano 1997
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  11. 11
    Slika omota

    Improved manufacturing technologies for microelectronics packaging / R.A. Bohlander.

    Izdano 19921993
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  12. 12
    Slika omota

    Polymer thick film / Ken Gilleo.

    Izdano ©1996
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  13. 13
    Slika omota

    Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.

    Izdano 1999
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  14. 14
    Slika omota

    Mechanical & electrical characterization & simulation / S.S. Sitarman.

    Izdano 19971998
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  15. 15
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    Evaluation and process development of wafer-level-applied underfill material systems for flip chip assembly / by Stephen Christopher Busch.

    Izdano 2001
    Knjiga

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  16. 16
    Slika omota

    Microelectronics interconnection and packaging / edited by Jerry Lyman.

    Izdano 1980
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  17. 17
    Slika omota

    Journal of microelectronic systems integration.

    Izdano c1993
    Continuing Resources

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  18. 18
    Slika omota

    The International journal of microcircuits and electronic packaging.

    Izdano 19922002
    Continuing Resources

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  19. 19
    Slika omota

    Multichip modules : systems advantages, major constructions, and materials technologies / edited by R. Wayne Johnson, Robert K.F. Teng, John W. Balde.

    Izdano ©1991
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  20. 20
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    Microelectronics packaging handbook / edited by Rao R. Tummala, Eugene J. Rymaszewski.

    Izdano ©1989
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