Electronics packaging forum: Multichip module technology issues / edited by James E. Morris.
Cita Chicago (17th ed.)Electronics Packaging Forum: Multichip Module Technology Issues / Edited by James E. Morris.
Cita MLA (9th ed.)Electronics Packaging Forum: Multichip Module Technology Issues / Edited by James E. Morris.
Atenció: Aquestes cites poden no estar 100% correctes.