(2001). Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package / by Chetan S. Paydenkar.
Chicago Style (17th ed.) CitationFlip Chip Assembly Process Development, Process Characterization, and Reliability Assessment of Polymer Stud Grid Array-chip Scaled Package / by Chetan S. Paydenkar. 2001.
MLA (9th ed.) CitationFlip Chip Assembly Process Development, Process Characterization, and Reliability Assessment of Polymer Stud Grid Array-chip Scaled Package / by Chetan S. Paydenkar. 2001.
Warning: These citations may not always be 100% accurate.