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| Формат: | Книга |
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| Мова: | Англійська |
| Предмети: | |
| Теги: |
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| era | |
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| format | Book |
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| geographic | |
| id | 68d3aa6a-bada-4110-a4e2-03d80da98296 |
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| language | eng |
| physical | 1 volume (various foliations) :illustrations ;28 cm |
| publication | |
| publishDate | 2001 |
| subjects | |
| title | Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package / by Chetan S. Paydenkar. |
| topic | Microelectronic packaging Microelectronic packaging Mechanical engineering |