Tohutoro APA (7th ed.)

(1985). Method for ultrasonic bonding to soft microelectric substrates: Patent application.

Tohutoru Kātū Chicago (17th ed.)

Method for Ultrasonic Bonding to Soft Microelectric Substrates: Patent Application. 1985.

Tohutoro MLA (9th ed.)

Method for Ultrasonic Bonding to Soft Microelectric Substrates: Patent Application. 1985.

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