APA (7th ed.) Citation

(1999). Chip scale package (CSP): Design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.

Chicago Style (17th ed.) Citation

Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications / John H. Lau, Shi-Wei Ricky Lee. 1999.

MLA (9th ed.) Citation

Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications / John H. Lau, Shi-Wei Ricky Lee. 1999.

Warning: These citations may not always be 100% accurate.