(1999). Chip scale package (CSP): Design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.
Chicago-čujuhus (17. p.)Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications / John H. Lau, Shi-Wei Ricky Lee. 1999.
MLA-čujuhus (9. p.)Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications / John H. Lau, Shi-Wei Ricky Lee. 1999.
Muitte dárkkistit čujuhemiid riektatvuođa, ovdal go geavahat daid iežat deavsttas.