APA (7. basım) Alıntı

(1999). Chip scale package (CSP): Design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.

Chicago Style (17. basım) Atıf

Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications / John H. Lau, Shi-Wei Ricky Lee. 1999.

MLA (9th ed.) Atıf

Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications / John H. Lau, Shi-Wei Ricky Lee. 1999.