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| Format: | Book |
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| Language: | English |
| Subjects: | |
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| era | |
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| format | Book |
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| id | e8ba1a28-e110-472c-af3e-0807da6ab921 |
| isbn | 0070383049 |
| issn | |
| language | eng |
| physical | xxii, 564 pages :illustrations ;24 cm. |
| publication | – publisher: McGrawHill dateOfPublication: 1999 |
| publishDate | 1999 |
| subjects | |
| title | Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee. |
| topic | Integrated circuits Microelectronic packaging. |