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Guardat en:
| Format: | Llibre |
|---|---|
| Idioma: | anglès |
| Matèries: | |
| Etiquetes: |
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| era | |
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| format | Book |
| genre | |
| geographic | |
| id | ac285bef-6da8-4fce-99e5-aef676b1aa3e |
| isbn | |
| issn | |
| language | eng |
| physical | xvi, 132 leaves :illustrations ;28 cm |
| publication | |
| publishDate | 1999 |
| subjects | |
| title | Study of warpage of base substrates and materials for large-area MCM-D packaging / by Anh Xuan-Hung Dang. |
| topic | Multichip modules (Microelectronics) Microelectronic packaging Mechanical engineering |